1¡¢ Liping Deng*, Jian Xia, Bingshu Wang, Hongliang Xiang, Effect of Cold Rolling and Subsequent Annealing on the Corrosion Resistance of Ag-containing CD4MCu Duplex Stainless Steels, Journal of Materials Engineering and Performance, Accepted. 2¡¢ Baoxue Zhou, Rong Yang, Bingshu Wang, Liping Deng*, Yonghao Zhang, Twinning behavior of puretitanium during rolling at room and cryogenic temperatures, Mater Sci Eng A, 2021, 803,140458 3¡¢ Mingxue Zhang, Liping Deng*, Bingshu Wang, Hongliang Xiang, Effect of torsional rate on the gradient microstructure, texture evolutions and microhardness of pure copper, Materials Characterization, 161(2020) 110141 4¡¢ Liping Deng*, Bingshu Wang, Ke Han, Rongmei Niu, Hongliang Xiang, Karl T. Hartwig, Xiaofang Yang. Response of microstructure to annealing in in situ Cu¨CNb microcomposite. J Mater Sci, 2019, 54:840-850 5¡¢ Liping Deng*, Zhifeng Liu, Bingshu Wang, Ke Han, Hongliang Xiang. Effects of interface area density and solid solution on the microhardness of Cu-Nb microcomposite wires. Mater Charact, 2019, 150:62-64 6¡¢ BingshuWang, JingjingShi, PengYe, Liping Deng*, ChenWang, JunfengChen, XiaohuaYang, QiangLi. In-situ investigation on nucleation and propagation of {10-12} twins during uniaxial multi-pass compression in an extruded AZ31 Mg alloy. Mater Sci Eng A, 2018, 731: 71-79 7¡¢ Liping Deng*, Bingshu Wang, Hongliang Xiang, Xiaofang Yang, Rongmei Niu, Ke Han. Effect of Annealing on the Microstructure and Properties of In-situ Cu¨CNb Microcomposite Wires. Acta Metall. Sin. (Engl. Lett.), 2016, 29(7), 668¨C673 8¡¢ Liping Deng*, Ke Han, Bingshu Wang, Xiaofang Yang, Qing Liu*. Thermal stability of Cu¨CNb microcomposite wires. Acta Materialia. 2015 101:181-188 9¡¢ µËÀöƼ*£¬ÁõÔ¾Ãù£¬Ñî½ÜÈð£¬Íô±þÊ壬ÑîÏþ·¼. Cu-Nb¸´ºÏÏ߲ĵľ¶ÏòÖ¯¹¹ºÍÏÔ΢Ӳ¶ÈµÄÑݱä¹æÂÉ, ²ÄÁÏÑо¿Ñ§±¨, 2016£¬30£¨11£©848-854 10¡¢ µËÀöƼ, Ke Han, ÑîÏþ·¼, ËïÔóÔª, ÁõÇì*. ¶îÍâ´¿Cu¶ÔCu-Nb¸´ºÏÏß²ÄÁ¦Ñ§¼°µ¼µçÐÔÄܵÄÓ°Ïì. Ï¡ÓнðÊô²ÄÁÏÓ빤³Ì. 2015, 7:1696-1701 11¡¢ L. Deng, K. Han, K. T. Hartwig£¬Siegrist Theo M.£¬Dong Lianyang£¬Sun Zeyuan£¬Yang Xiaofang*£¬Liu Qing*. Hardness, electrical resistivity and modeling in in-situ Cu-Nb microcomposites. Journal of Alloys and Compounds , 2014, 602(0):331-338 12¡¢ µËÀöƼ, ÑîÏþ·¼, Ke Han, ËïÔóÔª, ÁõÇì*. Cu-Nb¸´ºÏÏß²ÄÔÚÐαäÓëÍË»ð¹ý³ÌÖÐÏÔ΢½á¹¹ÑݱäµÄÑо¿. ½ðÊôѧ±¨, 2014, 50(2): 231-237 13¡¢ L. Deng£¬X. Yang£¬K. Han£¬Y. Lu£¬M. Liang£¬Q. Liu*£¬ Microstructure and texture evolution of Cu¨CNb composite wires. Materials Characterization, 2013: 124-133 14¡¢ µËÀöƼ, ÑîÏþ·¼, ¬ÑÇ·å, ÁºÃ÷, ÁõÇì*. Cu/Nb΢¹Û¸´ºÏÏß²ÄÖÐCuÑؾ¶ÏòµÄÖ¯¹¹Ñо¿. µç×ÓÏÔ΢ѧ±¨, 2011(4)£º399-402 15¡¢ ÅËÐųϣ¬µËÀöƼ*£¬Ê¯Ä«Ï©ÔöÇ¿Í»ù¸´ºÏ²ÄÁÏÖƱ¸¹¤ÒÕ¼°ÆäÐÔÄÜÑо¿½øÕ¹£¬»úе¹¤³Ì²ÄÁÏ£¬2022£¬´ý¼û¿¯¡£ 16¡¢ ÁõÖ¾·å£¬µËÀöƼ*£¬ÉòÀöÏ㣬¸ßÇ¿¶È¸ßµ¼µçÍ»ù¸´ºÏ²ÄÁϵÄÑо¿½øÕ¹£¬Èȼӹ¤Í³Ò»£¬2019£¨48£©£º14-18 17¡¢ ׯ¶þÅô£¬µËÀöƼ*£¬Öܺ£¿í£¬Íô±þÊ壬³õʼ֯¹¹¶ÔAZ31þºÏ½ðÊÒÎÂÀÉì±äÐÎÐÐΪµÄÓ°Ï죬Èȼӹ¤¹¤ÒÕ£¬2016£¨45£©£º118-121 18¡¢ B. Wang, L. Deng, C. Adrien, et al. Relationship between textures and deformation modes in Mg¨C3Al¨C1Zn alloy during uniaxial tension. Materials Characterization. 2015; 108: 42-50 19¡¢ Íô±þÊå, µËÀöƼ, Adrien Chapuis, ¹ùÄþ, ÀîÇ¿, AZ31þºÏ½ðÔÚƽÃæÓ¦±äѹËõ¹ý³ÌÖеÄÂÏÉúÐÐΪÑо¿, ½ðÊôѧ±¨, 2015, 51(12):1441-1448 20¡¢ B. Wang, L. Deng, N. Guo, et al. EBSD analysis of {10¨C12} twinning activity in Mg¨C3Al¨C1Zn alloy during compression. Materials Characterization. 2014; 98: 180-185 21¡¢ Jinyi Yao, Bingshu Wang, Liping Deng, Adrien Chapuis, Qiang Li, Qing Liu, Simulation of Texture Evolution and Deformation Mechanism in Mg-3Al-1Zn Alloy During Uniaxial Compression, Science China Technological Sciences, 2015, 58(12): 2052-2059 22¡¢ ÀîÔ¶î£, µËÀöƼ, »Ô־ǿ, ÍõÊéÕä. ·æÀû¶È³Ö¾Ãµ¶¼ôÓÃ4Cr10Si2ÂíÊÏÌå²»Ðâ¸ÖµÄÑÐÖÆ. ÖØÇì´óѧѧ±¨×ÔÈ»°æ, 2011, 34(1): 72-76 |